Events

April 6, 2016

Date(s): Tentatively once session per week starting April 6, 2016, through Jun 1, 2016; ASQ CRE Exam is scheduled for Jun 4, 2016
Time: 3:00pm-7:00pm Pacific time
Instructor: Greg Swartz and Pat McMahon
Length: 9 sessions
Cost: $900. We offer 25% discount for unemployed or for students not getting reimbursed.
Location: Via webinar

Description: Becoming certified as a Quality Engineer (CQE) can be valuable to your employer and your career. We have been offering this Exam Preparation Course for 15 years. Students have found it very valuable in preparing for the exam. Even if you are not planning on taking the exam but need a good, in-depth course in Quality Engineering, this can benefit you substantially.
To Register and for more info, please call 408.654.0499, x203

April 6, 2016

Date(s): Tentatively one session per week starting April 6, 2016, through Jun 1, 2016; ASQ CRE Exam is scheduled for Jun 4, 2016
Time: 3:00pm-7:00pm Pacific time
Instructor: Greg Swartz and Pat McMahon
Length: 9 sessions
Cost: $900. We offer 25% discount for unemployed or for students not getting reimbursed.
Location: Via webinar

Becoming certified as a Quality Engineer (CQE) can be valuable to your employer and your career. We have been offering this Exam Preparation Course for 15 years. Students have found it very valuable in preparing for the exam. Even if you are not planning on taking the exam but need a good, in-depth course in Quality Engineering, this can benefit you substantially.

To Register and for more info, please call 408.654.0499, x203

We look forward to seeing you at all of our events!

Jay and all the Ops Staff

March 17, 2016

Date: Thursday, March 17, 2016
Time: 8:00 AM – 45:00 PM (Breakfast & Lunch are provided)
Location: Juniper Networks (1194 North Mathilda Ave, Sunnyvale 94089. Building 1, Tuolumne Room)
Attendance: Registration is Free!! Attend on-site or Remote via WebEx

Join us on Thursday, March 17, 2016 for a day of learning, innovation and networking at the 5th Annual IEEE International Reliability Innovations Conference. The conference serves as a leading platform for engineering professionals to share innovative concepts, design, methodologies, tools and applications to address challenges in reliability. Engage in technical sessions, workshops, seminars and panel sessions on the latest advancement and network with like-minded professionals from all over the world.

The conference is brought to you by Cisco Systems, Juniper Networks and OPS Ala carte in collaboration with the IEEE Reliability Society (SCV Chapters), along with our prominent sponsors.

We look forward to seeing you at all of our events!

Jay and all the Ops Staff

March 9, 2016

Host: Ops A La Carte
Speaker: John Cooper, Senior Reliability Engineer
Time: 12:00pm-1:00pm Pacific Time
Register:
https://attendee.gotowebinar.com/register/8806845518889777665

Many of us are involved in HALT testing; sometimes we wonder if we are doing it correctly or why it is done a certain way. Some of us may not understand it and would like a basic review.

This webinar will include an introduction to HALT, an understanding of what it will do, and what it will not do, and how to plan for it. We will explore fixturing, setup, functional verification, and the actual running of the test. We will discuss the real value of HALT.

Advanced topics will be touched on such as pitfalls of HALT, how it can be misunderstood, and some case studies.

Tune in to this webinar for a refresher; invite your associates, such as design engineers or project managers, who would appreciate understanding HALT and might have questions.

To Register and for more info, please call 408.654.0499, x203

We look forward to seeing you at all of our events!

Jay and all the Ops Staff

FREE WEBINAR – February 10, 2016

Host: Ops A La Carte
Speaker: James McLinn, Senior Reliability Engineer
Time: 12:00pm-1:00pm Pacific Time
Register: gotowebinar.com

Selecting a set of stresses for accelerated life testing can be a challenge for some accelerated life tests. Determining the best set of stresses is only the start of the reliability challenge. Should one employ a combination of temperature and vibration, temperature and humidity, mechanical stress and temperature, corrosive materials and temperature, temperature cycles and vibration or some other stress combination? If one important goal of the ALT is to simulate the customer environment and thereby extrapolate the test results to the field, then selecting the best combination of stresses is important.

Not all customers have the same set of conditions in the field. Many customers experience more than two operating stresses in the field. It may be that four or more stresses may be present. Thus, selecting only two stresses will represent a compromise to field simulation. Add high levels of acceleration in each selected stress and complications arise. There may also be issues with non-linear behavior appearing in the test results.

This webinar will present approaches to selecting the best set of two stresses, showing ways to limit the test conditions and then handling some of the data analysis issues resulting from any non-linear test results. All of these considerations are important to achieving successful ALT results and then extrapolating these to the field.

January 30, 2016
Fracture Mechanics & Fatigue: Theory and Modeling for Mechanical Engineers
by Dr. Metin Ozen, ASME Fellow, Principal
Ozen Engineering Inc, Sunnyvale, CA
(co-sponsored ASME SCV Chapter)

Date: Saturday, January 30, 2016
Time: 9:00 AM – 4:00 PM
Location: Santa Clara University, CA 95054
Admission: ASME or IEEE Member: $80 per person, Non-Member: $120 per person; Student, Unemployed or Retired Member: $45 per person.

All in-person attendees will receive a light lunch. Breaks with snacks and drinks will be part of the seminar experience.

This course covers detailed information on the Fracture Mechanics and Fatigue theory as well as numerical modeling. The course reviews the fundamentals of fracture mechanics and fatigue; history, derivation of mathematical expressions for stress intensity factors; 2D versus 3D, crack tip stress field, three modes of fracture, maximum principal stress criterion, crack initiation and crack propagation, strain energy density theorem, J-Integral, mixed mode cracking, XFEM method, cohesive zone modeling, implementation of crack modeling in ANSYS Workbench, fatigue crack growth, stress/strain/energy based fatigue, numerical modeling of fatigue.

Attendees will receive instructions to download free 30 days ANSYS/Mechanical software license at the end of the seminar (restrictions apply). Attendees will not need either the software installed on their system or experience with ANSYS to attend the seminar. Software can be downloaded after the seminar to practice the workshop problems demonstrated during the course.

Register here! Please do NOT remove the promotional code ‘IEEE’ listed above the ‘Order Now’ button on the registration page.

Jaunary 25-28, 2016 in Tucson, AZ

The Annual Reliability and Maintainability Symposium (RAMS®) is the premier event in the reliability, availability, and maintainability engineering disciplines. Combining tutorials, presentations, CEUs, certifications, and networking into one week-long program, the RAMS® delivers cutting edge information to all technical industries.

We have speakers at this conference so make a point to visit their sessions. And please stop by and say ‘hi’ to us at our booth!

For more information about this Conference, visit www.rams.org

First Session – July 29, 2015

Date(s): July 29, Aug 12, 19, 20; Sept 1, 3, 16, and 23, 2015, ASQ CRE Exam is on Oct 3, 2015
Time: 3:00pm-7:00pm Pacific time
Instructor: Les Warrington
Length: 8 sessions
Cost: $900. We offer 25% discount for unemployed or for students not getting reimbursed.
Location: Via webinar

Description: Becoming certified as a Reliability Engineer (CRE) can be valuable to your employer and your career. We have been offering this Exam Preparation Course for 15 years. Students have found it very valuable in preparing for the exam. Even if you are not planning on taking the exam but need a good, in-depth course in Reliability Engineering, this can benefit you substantially.

To Register and for more info, please call 408.654.0499, x203

OR

Contact Us

FREE WEBINAR – June 10, 2015

Host: Ops A La Carte
Speaker: Indra Desai, Operations Consultant, Guest Speake
Time: 12:00pm-1:00pm Pacific Time
Register: https://attendee.gotowebinar.com/register/7714716006381367298

Reliability of products or service provided is critical to the bottom line of any business. Impact of unreliable products or services leaves a bad taste with the customer, which impacts customer loyalty. Finding non-compliances and fixing them is reactive, and may end up as short gap band aids. Thinking about and integrating Reliability from inception helps in retaining customer loyalty. This Webinar will discuss the impact of Reliability and how to avoid the pitfalls. And how to integrate Reliability in Business Process:

• What does reliability mean from customer perspective?
• Impact of non-reliability to bottom line;
• When and how to integrate reliability in Business Process.

We will review case studies of impacts of ‘integrated reliability’.

Food sponsored by
ICE Labs, ISO 9001 & 17025 Reliability Test Lab

Title: Adhesion and Thermomechanical Reliability
Invited Speaker: Prof. Reinhold H. Dauskardt, Professor of Materials Science & Engineering, Stanford University
Time: Check in and food at 6:00PM – 6:30 PM
Presentation from 6:30 PM to 7:30 PM

Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria) (View Map)
Admission: Open to all IEEE members and non-members for FREE!
Abstract: Material layers and interfaces in emerging device packaging and flexible electronic technologies operate near the envelope of their mechanical and adhesive properties with remarkably high levels of film stress. Debonding and cohesive fracture are major challenges for device reliability at all levels of processing, packaging and service. The thermomechanical properties of device structures including complex back-end interconnect, emerging 3-D packages, and flexible organic electronic structures are critical for aiding new materials integration as well as understanding device reliability.

For more information and to register, visit: Eventbrite Registration