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September 28-30, 2016
2016 Accelerated Stress Testing and Reliability (ASTR) Conference

Pensacola Beach, FL — The 2016 Accelerated Stress Testing and Reliability (ASTR) Conference is focused on highlighting cutting-edge methods to deliver maximum cost-benefits from reliability testing. ASTR 2016 is relevant to manufacturers in the aerospace, automotive, consumer electronics, defense, medical, telecommunications and other industries where reliability is a key driver of operational and business success. If your company needs to improve product testing with a goal to improve reliability, reduce warranty costs, improve profits, gain market share, and be more competitive, then the 2016 ASTR Conference is for you.

We have speakers at this conference so make a point to visit their sessions. And please stop by and say ‘hi’ to us!

For more information, visit www.ieee-astr.org

Blue Fading Rule

August 4, 2016
IEEE Santa Clara Valley Reliability

Chapter Meeting
Surfaces, Interfaces and Microelectronic Packaging
by Dr. Guna Selvaduray, Ph.D.

Date: Thursday, August 4, 2016
Time: 6:00pm – 8:00pm
6:00pm – 6:30pm – Check-in
6:30pm – 8:00pm – Presentation

Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria, Building B)
Admission: Open to all IEEE members and non-members for FREE

All in-person attendees will receive a light lunch. Breaks with snacks and drinks will be part of the seminar experience.

Abstract: Of the total cost involved in producing a microelectronic component, between 50% to 90% goes towards the packaging, depending on the specific type of die and packaging technology. However, approximately 95% of the reliability issues are actually related to the packaging rather than the die. There are a variety of surfaces and interfaces, the integrity of which needs to be maintained at all times, in order for the die to be able to function reliably over its service life. Some of these surfaces and interfaces are obvious while others are not. The integrity of these surfaces can have a major impact on the long term reliability of the packaged die. The detailed composition of the interface can also change over time. This presentation will focus on a discussion of the interfacial interactions between Pb-free solders and substrates, the nature of these interactions, the intermetallic compounds (IMC) that are formed, and how these interaction layers can change over time.

Attendance to this seminar will count towards professional development hours for IEEE, ASQ. Please feel free to forward this message to your friends and colleagues. – Register here!

“50 Ways To Improve Product Reliability”
July 2016 – The 2nd Edition Of Mike Silverman’s Classic Book

With “How Reliable is Your Product? (2nd Edition),” Mike Silverman and Adam Bahret have delivered what few have done before: a comprehensive yet succinct overview of the field of reliability engineering and testing. Engineers and engineering managers will find much in this book of immediate practical value.

Available now in hardcover on Amazon!!!

Jay and all the Ops Staff

FREE RELIABILITY EVENT
Sept 10, 2014: Free Webinar 12pm-1pm PDT

Using a Warranty Event Cost Model to Drive Warranty Cost Reduction Strategy
Speaker: Robert Mueller
Date: Wednesday, Sept 10, 2014 (12pm-1pm PDT)
Space is limited. Reserve your Webinar seat now at:
https://www2.gotomeeting.com/register/605179322

Many organizations have become excellent at tracking both their product’s field failures and determining component reliability for current products from field repair data. These component reliability and product field failure rates now need to be converted to fully loaded warranty costs. Only when the ‘cost’ of a component’s failure is expressed in its fully burdened dollars can the relative importance & priority to mitigate that failure mode can best be evaluated. Putting it another way, when funding reliability improvement efforts, management listens most attentively to $s, not rates. Developing a simple and easily applied warranty event cost model is a central capability to reliability improvement engineering programs.

In this webinar you will learn about the warranty event model and how it easily transforms frequency of field failures into fully loaded warranty or service costs. You will learn how you can easily compare the fully loaded warranty costs of various component field failures and warranty event types. Further, you will learn how to apply the model to help prioritize reliability improvement initiatives based on both its impact on manufacturing costs and on its likely field/service cost reductions. Finally, the nasty little hidden secrets of software related warranty events will be exposed.

About the Speaker (Bob Mueller, MS, CQE): Bob is a product development professional with 30+ years of technical and management experience in software intensive product development as well as in R/D process and quality systems development including extensive consulting experience with cross-functional product development teams and senior management. After receiving his M.S. in Physics in 1973, Bob joined Hewlett-Packard in Cupertino, CA in IC process development. In the next three decades before leaving HP, he held numerous positions in R/D, R/D management and technical consulting including management positions in the computer, analytical, healthcare business units and in HP’s internal engineering consulting organization. For the past decade Bob has focused on agile development methodologies and practices that drive software reliability, improved software support operations, warranty chain management and customer satisfaction. . Bob is a senior member of the ASQ and a Certified Quality Engineer (CQE). He is the chair of the training working groups for the Institute of Warranty Chain Management and has taught many courses at local colleges.

Sept 10-12: Accelerated Stress Testing & Reliability Workshop (ASTR)

Crowne Plaza
St. Paul – Riverfront
11 Kellogg Blvd E
St. Paul, MN 55101

See more details here: http://www.ieee-astr.org/

And a few more webinars from our partners at Hobbs Engineering

– August 6 Understanding Shock & Vibration – 3 hrs
– August 20 Recent Advances in Design of Experiments – 3 hrs
– September 10 Vital Technical Tools for Q and R Engineers – 3 hrs
– September 17-18 Introduction to Reliability – Two 3 hour sessions

If you are interested in any of these webinars, please send us an email at info@opsalacarte.com and we will send you more information.

Aug 13 – Oct 1: Reliability Engineer (CRE) Prep Course

Time: 6pm-10pm PDT on Wednesdays, one night a week
Instructor: Les Warrington
Length: 7 weeks
Cost: $900, available via webinar

Aug 13: Free Webinar 12-1pm PDT
Register Here

Title: Matching Design FMEA Styles to Program Objectives and Personal Engineering Culture
Speaker: Adam Bahret
Date: Wednesday, August 13, 12-1pm PDT

There are many styles of Design Failure Mode and Effects Analysis (FMEA) practiced in industry today. For an organization it can be difficult to know which best matches their program objectives and culture. Overcoming the reluctance of participation due to their time consuming nature and finding a way to implement the corrective actions into a fast moving development program is difficult. Many FMEAs only yield a fraction of their potential benefit because of these challenges. This webinar will discuss these FMEA types and how to overcome these engagement and implementation challenges.