September 28-30, 2016
2016 Accelerated Stress Testing and Reliability (ASTR) Conference

Pensacola Beach, FL — The 2016 Accelerated Stress Testing and Reliability (ASTR) Conference is focused on highlighting cutting-edge methods to deliver maximum cost-benefits from reliability testing. ASTR 2016 is relevant to manufacturers in the aerospace, automotive, consumer electronics, defense, medical, telecommunications and other industries where reliability is a key driver of operational and business success. If your company needs to improve product testing with a goal to improve reliability, reduce warranty costs, improve profits, gain market share, and be more competitive, then the 2016 ASTR Conference is for you.

We have speakers at this conference so make a point to visit their sessions. And please stop by and say ‘hi’ to us!

For more information, visit www.ieee-astr.org

Blue Fading Rule

August 4, 2016
IEEE Santa Clara Valley Reliability

Chapter Meeting
Surfaces, Interfaces and Microelectronic Packaging
by Dr. Guna Selvaduray, Ph.D.

Date: Thursday, August 4, 2016
Time: 6:00pm – 8:00pm
6:00pm – 6:30pm – Check-in
6:30pm – 8:00pm – Presentation

Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria, Building B)
Admission: Open to all IEEE members and non-members for FREE

All in-person attendees will receive a light lunch. Breaks with snacks and drinks will be part of the seminar experience.

Abstract: Of the total cost involved in producing a microelectronic component, between 50% to 90% goes towards the packaging, depending on the specific type of die and packaging technology. However, approximately 95% of the reliability issues are actually related to the packaging rather than the die. There are a variety of surfaces and interfaces, the integrity of which needs to be maintained at all times, in order for the die to be able to function reliably over its service life. Some of these surfaces and interfaces are obvious while others are not. The integrity of these surfaces can have a major impact on the long term reliability of the packaged die. The detailed composition of the interface can also change over time. This presentation will focus on a discussion of the interfacial interactions between Pb-free solders and substrates, the nature of these interactions, the intermetallic compounds (IMC) that are formed, and how these interaction layers can change over time.

Attendance to this seminar will count towards professional development hours for IEEE, ASQ. Please feel free to forward this message to your friends and colleagues. – Register here!

“50 Ways To Improve Product Reliability”
July 2016 – The 2nd Edition Of Mike Silverman’s Classic Book

With “How Reliable is Your Product? (2nd Edition),” Mike Silverman and Adam Bahret have delivered what few have done before: a comprehensive yet succinct overview of the field of reliability engineering and testing. Engineers and engineering managers will find much in this book of immediate practical value.

Available now in hardcover on Amazon!!!

Jay and all the Ops Staff

August / September 2016
Certified Reliability Engineer (CRE) Preparation Course for Fall 2016 – Registration Is Open!!
Date(s): Tentatively starting in August 2016 and running through the end of September 2016; ASQ CRE Exam is scheduled for Oct 1, 2016
Time: 3:00pm-7:00pm Pacific time
Instructor: Les Warrington
Length: 8 sessions
Cost: $900. We offer 25% discount for unemployed or for students not getting reimbursed.
Location: Via webinar

Exam Application Deadline: August 12, 2016

Becoming certified as a Reliabililty Engineer (CRE) can be valuable to your employer and your career. We have been offering this Exam Preparation Course for 15 years.

Students have found it very valuable in preparing for the exam. Even if you are not planning on taking the exam but need a good, in-depth course in Reliability Engineering, this can benefit you substantially.

May 4, 2016
FREE RELIABILITY WEBINAR – “Advantages of IEEE P1633 for Practicing Software Reliability”
Host: Ops A La Carte
Speaker: Ann Marie Neufelder, Founder, SoftRel LLC
Date: May 4, 2016
Time: 12:00pm-1:00pm Pacific Time
Register: https://attendee.gotowebinar.com/register/8970286823844085251

Software reliability engineering has existed for almost 50 years. Software reliability metrics such as failure rate, MTBF, availability and reliability have been used successfully in industry to plan, manage and demonstrate the achievement of system reliability objectives. The newly revised IEEE 1633 Recommended Practice for Software Reliability provides actionable step by step procedures for employing software reliability models and analyses during any phase of software or firmware development with any software lifecycle model for any industry or application type.

It includes easy to use models for predicting software reliability early in development and during test and operation. It also provides for methods to analyze software failure modes and include software in a system fault tree analysis.

For persons who are acquiring software it provides the ability to assess the reliability of COTS, FOSS, and contractor or subcontractor delivered software.

This presentation will cover the key features of the IEEE 1633 Recommended Practices for software reliability.

To Register and for more info, please call 408.654.0499, x203

April 6, 2016
FREE RELIABILITY WEBINAR – “Conducting an Effective DVT”
Host: Ops A La Carte
Speaker: Gerry Cohen, Senior Reliability Engineer
Date: April 6, 2016
Time: 12:00pm-1:00pm Pacific Time
Register: https://attendee.gotowebinar.com/register/1255349082256235777

A Design Verification Testing (DVT) is usually an integral part of many technology provider’s qualification process.

But how effective is it in light of design, manufacturing, suppliers and customers?

This webinar will explore several methods and tools useful in conducting DVT.

To Register and for more info, please call 408.654.0499, x203

We look forward to seeing you at all of our events!

Jay and all the Ops Staff

April 6, 2016

Date(s): Tentatively once session per week starting April 6, 2016, through Jun 1, 2016; ASQ CRE Exam is scheduled for Jun 4, 2016
Time: 3:00pm-7:00pm Pacific time
Instructor: Greg Swartz and Pat McMahon
Length: 9 sessions
Cost: $900. We offer 25% discount for unemployed or for students not getting reimbursed.
Location: Via webinar

Description: Becoming certified as a Quality Engineer (CQE) can be valuable to your employer and your career. We have been offering this Exam Preparation Course for 15 years. Students have found it very valuable in preparing for the exam. Even if you are not planning on taking the exam but need a good, in-depth course in Quality Engineering, this can benefit you substantially.
To Register and for more info, please call 408.654.0499, x203

March 3, 2016

Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab

Title: Physics- based life distribution and reliability modeling of solid state drives
Invited Speaker: Dr. Alexander Parkhomovsky, Ph.D., Engineering Development Manager at Lumentum
Date: Thursday, March 3, 2016
Time: Check in and food at 6:00PM – 6:30 PM. Presentation from 6:30 PM to 7:30 PM
Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria, Building B)

Admission: Open to all IEEE members and non-members

Abstract: The model of solid state drive (SSD) life time distribution from physics-based life model considering the random nature of real world customer data usage and product inherent physical properties is developed. The talk is focused on the following two cases:

Case 1: When only field write duty cycle is treated as a random variable while assuming all other physical characteristics are non-random, it is found that the SSD life time follows . Reciprocal-Weibull distribution when field Write Duty Cycle follows Weibull distribution, . Reciprocal-Exponential distribution when field Write Duty Cycle follows Exponential distribution, . Lognormal distribution when field Write Duty Cycle follows Lognormal distribution, . Reciprocal-Normal Distribution when field Write Duty Cycle follows Normal distribution. The corresponding mathematical expressions for reliability, unreliability, hazard rate, MTTF, etc. are derived for each scenario accordingly.

Case 2: In real world, SSD endurance rating is also a random variable due to part-to-part variance from material in-homogeneity and inherent defects from manufacturing process. Given the distributions of field customer write duty cycle (stress) and SSD endurance rating (strength), the distribution of lifetime random variable can be derived either analytically, if closed form solution exists, or numerically using Monte Carlo simulation if no closed form solution exists. This paper provides a special case where the analytic solution exists when both random variables follow Lognormal distribution. A numerical example is given to show the application of the models developed in this paper. The results derived in this paper will benefit the SSD industry in various aspects of product design, development, reliability testing and prediction, field return/failure estimation and warranty management.

For more information and to register, visit: Eventbrite Registration

April 6, 2016

Date(s): Tentatively one session per week starting April 6, 2016, through Jun 1, 2016; ASQ CRE Exam is scheduled for Jun 4, 2016
Time: 3:00pm-7:00pm Pacific time
Instructor: Greg Swartz and Pat McMahon
Length: 9 sessions
Cost: $900. We offer 25% discount for unemployed or for students not getting reimbursed.
Location: Via webinar

Becoming certified as a Quality Engineer (CQE) can be valuable to your employer and your career. We have been offering this Exam Preparation Course for 15 years. Students have found it very valuable in preparing for the exam. Even if you are not planning on taking the exam but need a good, in-depth course in Quality Engineering, this can benefit you substantially.

To Register and for more info, please call 408.654.0499, x203

We look forward to seeing you at all of our events!

Jay and all the Ops Staff

March 17, 2016

Date: Thursday, March 17, 2016
Time: 8:00 AM – 45:00 PM (Breakfast & Lunch are provided)
Location: Juniper Networks (1194 North Mathilda Ave, Sunnyvale 94089. Building 1, Tuolumne Room)
Attendance: Registration is Free!! Attend on-site or Remote via WebEx

Join us on Thursday, March 17, 2016 for a day of learning, innovation and networking at the 5th Annual IEEE International Reliability Innovations Conference. The conference serves as a leading platform for engineering professionals to share innovative concepts, design, methodologies, tools and applications to address challenges in reliability. Engage in technical sessions, workshops, seminars and panel sessions on the latest advancement and network with like-minded professionals from all over the world.

The conference is brought to you by Cisco Systems, Juniper Networks and OPS Ala carte in collaboration with the IEEE Reliability Society (SCV Chapters), along with our prominent sponsors.

We look forward to seeing you at all of our events!

Jay and all the Ops Staff