Tech Shorts

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Tech Shorts

Exponential

The exponential distrubition is the simplest distribution used in life data analysis. The distribution applies in very few situations, yet is widely used due to its simplicity.

  • Exponential Reliability Function
  • Exponential Hazard Rate Function
  • Exponential Probability Density Function
  • Exponential Reliability Function
  • Log Normal

    The lognormal distribution has common use in life data analysis. It is appropriate as a time to failure model for failures caused by a degradation process from a mix of failure mechanisms which combine multiplicatively.

  • Log Normal Cumulative Density Function
  • Log Normal Hazard Rate Function
  • Log Normal Probability Density Function
  • Log Normal Reliability Function
  •   Normal

    The normal or Gaussian distribution has limited use inlife data analysis. It is very useful and widely used for process control, capability studies, hypothesis teasing and other applications.

  • Normal Cumulative Density Function
  • Normal Hazard Rate Function
  • Normal Probability Density Function
  • Normal Reliability Function
  • Weibull

    The Weibull distribution has widespread use in life data analysis. It is a flexible distribution able to model decreasing or increasing failure rates and approximate many other distributions including exponential and normal.

  • Weibull Reliability Function
  • Weibull Probability Density Function
  • Weibull Hazard Rate Function
  • Weibull Cumulative Density Function

  • Voltage Stress AF Equation
  • An example of the Eyring Model combining two stress terms one of which is temperature, Peck’s Model applies for microelectronics plastic encapsulated components. Operated under bias this approach acclerates the metalization corrosion failure mechanism.

  • Peck’s Temperature-Humidity Model
  • An example of the Eyring Model combining two stress terms one of which is temperature, Peck’s Model applies for microelectronics plastic encapsulated components. Operated under bias this approach acclerates the metalization corrosion failure mechanism.

     
  • Coffin Manson Model for Cyclic Fatigue
  • The Coffin-Manson model for cyclic fatigue relates the ration of cycles to failure. It applies for stress due to isothermal mechanical fatigue cycling or merchanical stress fatigue due to thermal cycling.

  • Arrehenius Rate Equation
  • The Arrhenius rate equation (Arrhenius 1889) describes the relationship between temperature of thermally activated mechanisms. It applies to solide state diffusion, chemical reactions, and many other failure mechanisms.