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2015 EVENTS:

Click here for our public Google Calendar at Calendar of Events

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2015 Free Webinar Series - First or Second Wednesday of Each Month 12pm-1:30pm PST

About Event: On the first or second Wednesday of each month, we will bring you a free webinar topic. Below is our next webinar. You can click on the registration page to register for event.

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Coming Up is:

June 2-4, 2015 - 2015 Applied Reliability Symposium

Click here for more information.

June 2-4, 2015 in Tucson, AZ

Reliability engineering has never been more important than in today's economic environment. Whether you are just beginning your reliability journey or you are a weathered veteran, this conference has something for you. You will have the opportunity to network with others in your field while learning first-hand about real world applications by expert practitioners.

The ARS is one of the fastest-growing reliability forums and serves as a great way to further your education and shape the industry.

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Thursday, June 4, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Jun 4, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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June 4, 2015 - IEEE Santa Clara Valley Reliability Chapter Meeting

Food sponsored by ICE Labs, ISO 9001 & 17025 Reliability Test Lab

Title: Adhesion and Thermomechanical Reliability
Invited Speaker: Prof. Reinhold H. Dauskardt, Professor of Materials Science & Engineering, Stanford University
Time: Check in and food at 6:00PM - 6:30 PM
Presentation: from 6:30 PM to 7:30 PM
Location: Qualcomm Inc., 3165 Kifer Rd, Santa Clara, CA, 95051 (Meeting will be in the cafeteria) (View Map)
Admission: Open to all IEEE members and non-members for FREE!
Abstract: Material layers and interfaces in emerging device packaging and flexible electronic technologies operate near the envelope of their mechanical and adhesive properties with remarkably high levels of film stress. Debonding and cohesive fracture are major challenges for device reliability at all levels of processing, packaging and service. The thermomechanical properties of device structures including complex back-end interconnect, emerging 3-D packages, and flexible organic electronic structures are critical for aiding new materials integration as well as understanding device reliability.

For more information and to register, visit: Eventbrite Registration

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June 10, 2015 - FREE WEBINAR - "Integrating Reliability in Business Process"

Host: Ops A La Carte
Speaker: Indra Desai, Operations Consultant, Guest Speaker
Time: 12:00pm-1:00pm Pacific Time
Register: https://attendee.gotowebinar.com/register/7714716006381367298

Reliability of products or service provided is critical to the bottom line of any business. Impact of unreliable products or services leaves a bad taste with the customer, which impacts customer loyalty. Finding non-compliances and fixing them is reactive, and may end up as short gap band aids. Thinking about and integrating Reliability from inception helps in retaining customer loyalty. This Webinar will discuss the impact of Reliability and how to avoid the pitfalls. And how to integrate Reliability in Business Process:

• What does reliability mean from customer perspective?
• Impact of non-reliability to bottom line;
• When and how to integrate reliability in Business Process.

We will review case studies of impacts of 'integrated reliability'.

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Thursday, July 2, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Jul 2, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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Thursday, August 6, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Aug 6, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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Thursday, September 3, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Sep 3, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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September 9-11, 2015 - 2015 Accelerated Stress Testing and Reliability Conference

Click here for more information.

September 9-11, 2015 in Boston, MA

The 2015 Accelerated Stress Testing and Reliability (ASTR) Conference is focused on highlighting cutting-edge methods to deliver maximum cost-benefits from reliability testing. ASTR 2015 is relevant to manufacturers in the aerospace, automotive, consumer electronics, defense, medical, telecommunications and other industries where reliability is a key driver of operational and business success. If your company needs to improve product testing with a goal to improve reliability, reduce warranty costs, improve profits, gain market share, and be more competitive, then the 2015 ASTR Conference is for you!

Abstract Submission Deadline is April 17, 2015; more info here.

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Thursday, October 1, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Oct 1, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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Thursday, November 5, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Nov 5, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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December 3, 2015 - IEEE Silicon Valley Discussion

http://www.ewh.ieee.org/r6/scv/rl/events.htm

When: Thu Dec 3, 2015 6:30pm 8:30pm Pacific Time
Where: Agilent Facility - 5301 Stevens Creek Blvd, Cupertino CA

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red arrow Many New Reliability Services & Reliability Seminars added! Click here for details >

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