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"Lead-free is now a reality for electronics manufacturers, with legislation in place the clock is ticking and companies need to respond. This is the most significant change to electronics manufacturers since the move away from CFCs and solutions and must be in place by July 1st, 2006. Ops A La Carte provides a bottoms up from basics approach to reliability risks associated with the change to lead free solders and components. Their thorough knowledge and experience of reliability engineering tools provided an excellent base to PSC in developing an on-going reliability assessment plan for our products as we make this change to lead free electronic assemblies. They have assisted me every step of the way in ensuring we will be compliant to this legislation while maintaining our high level of product reliability and maintaining our customer loyalty. Ops A La Carte has also continued to provide me with much needed answers and guidance long after the original contract, for which I am truly grateful. I would highly recommend Ops A La Carte to anyone interested in quality and reliability services as well as RoHS reliability risks assessment as it relates to their products or services."
---Roger Swets, Senior Reliability Engineer, PSC Inc.
............................................... EDUCATION on the best tools for Reliability Engineering. INTEGRATION of all Elements of Reliability Programs for Maximum Value. Public and In-House Courses presented by world-class instructors directly in Silicon Valley. |
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 Education & Seminars
Restriction of Hazardous Substances (RoHS)
OBJECTIVES
Like the rest of the electronics industry, your products will transition to Restriction of Hazardous Substances (RoHS) compliance prior to the deadlines in 2006. This includes the transition to Lead-Free Solder, and at this time, there are significant reliability uncertainties around Lead-Free Solder. Even if your product does not need to be compliant, the materials and processes that make up your product are changing. As one major consumer product team concluded, doing nothing would double the field failure rate of the electronics. Given limited resources, you and your team may not have the time or expertise to determine the areas of greatest risk and how best to manage the transition.  Download brochure (pdf)
WHO SHOULD ATTEND
This course is intended for those involved in the transition to lead-free compliance. Like ISO900, this typically touches about every function within a company.
OUTLINE
Introduction• To Transition or NOT to Transition: That is NOT the question.• Who is Exempt• New TrendsHighlight of Some of the Risks • Higher reflow temperatures• Solderability and wetting• Solder joint durability• Adverse solder metallics• Component packaging compatibility• Moisture ingress ("popcorning")• Agressive fluxes• Tin whiskers• Tin pest• PCB FR4 construction changes• Solder voids due to inter-metallic contamination• Shock loadingSolutions/Mitigations to the risks• What is the industry doing to combat these new risks• What can you do?• BOM Scrubs• XRF equipment• Chemical analysis• BOM ScrubsManufacturing Audits• Manufacturing Audit Checklists• What to look for in the audit• Getting cross-sections at the end of the auditNew Trends/What the Future has in Store for UsConclusion
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